When you are in the market for top-quality NSN products like Microcircuit Memory items listed with the part number DEL1403N-70LM, we have you covered here on NSN Parts Dispatch. Manufactured by Sgs Thompson Microelectronics Inc and listed alongside the NSN 5962012485010, part number DEL1403N-70LM is readily available for procurement on our website at any time. To learn more about this item or to initiate procurement, be sure to complete the RFQ form that we have provided below. Using offered information such as your target price or expected shipping time frame, we can best formulate a solution that closely caters to your unique needs and interests while offering a response in just 15 minutes or less.
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To make your search as simple as possible, we list every offering with as much applicable information as we can. For example, part number DEL1403N-70LM with the NSN 5962-01-248-5010 is specially listed under FSC 5962 Microcircuits Electronic. Furthermore, as this item is manufactured by Sgs Thompson Microelectronics Inc under CAGE Code 60911, you can determine the exact facility that it traces back to. With such information, you can always best ensure that you only procure the exact items you require for carrying out operations. If you are ready to initiate the purchasing process for this item, send us a completed RFQ form today or get in contact with a team member through phone or email!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-248-5010 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012485010 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| IDT6167L70LB | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.425 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.290 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.085 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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